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发布于:2019-3-27 10:52:33  访问:66 次 回复:0 篇
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Soldering Iron And Stand
9. Finishing - the process of coating the pad areas having a slim layer of solder to organize the board for the wave that is eventual or reflow soldering process that will take place at a later time after the elements have already been placed.
10. Silk Screening - the entire process of using the markings for component designations and component outlines to your board. Can be applied to just the top part or to both sides if components are installed on both top and bottom sides.
11. Routing - the process of breaking up multiple boards from a panel of identical panels; this procedure also allows cutting notches or slots to the board if needed.
12. Quality Control - a inspection that is visual of boards; can also end up being the process of inspecting wall quality for plated through holes in multilayer boards by cross-sectioning or other techniques.
13. electric Testing - the process of checking for continuity or shorted connections regarding the panels by means using a voltage between various points regarding the board and determining in cases where a present flow occurs. Depending upon the board complexity, this process might need a specially created test fixture and test system to integrate utilizing the test that is electrical utilized by the board maker.
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Nevertheless, both in construction kinds, the component leads are nevertheless electrically and mechanically fixed to the PCB with molten metal solder.
With regards to the number of boards that require become assembled will determine how the elements are going to be soldered. Then soldering components to the Printed Circuit Board is best done by machine placement if it is for a high production volume. Machine positioning is completed with bulk wave reflow or soldering ovens. Otherwise, in the event that production amount is for tiny volume prototypes, soldering by hand works fine in many instances (Ball Grid Arrays are in fact impossible to solder by hand).
Often, through-hole and surface-mount construction has become done in one PCB assembly because some required electronic components only available in through-hole packages, while others are merely available in surface-mount packages. Additionally, this is a justification to use both for the methods throughout the same construction because through-hole mounting can in fact offer more power for the electronic elements which are more likely to go through some physical stress. If you know your PCB isn`t likely to go through any real stress, then it could be more smart to use surface-mount techniques to be able to use up less space in your board.
After the elements have now been completely constructed on the PCB, it will always be best to test to ensure that the board functions correctly also to the performance required. Here are some associated with the ways that they are tested after they have been assembled.
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